| 长度(L) | 3.20mm ±0.20mm | 
| 宽度(W) | 1.60mm ±0.20mm | 
| 厚度(T) | 1.60mm ±0.20mm | 
| 端子宽度(B) | 0.20mm Min. | 
| 端子间隔(G) | 1.00mm Min. | 
| 推荐焊盘布局(PA) | 2.10mm to 2.50mm(Flow Soldering) 2.00mm to 2.40mm(Reflow Soldering) | 
| 推荐焊盘布局(PB) | 1.10mm to 1.30mm(Flow Soldering) 1.00mm to 1.20mm(Reflow Soldering) | 
| 推荐焊盘布局(PC) | 1.00mm to 1.30mm(Flow Soldering) 1.10mm to 1.60mm(Reflow Soldering) | 
| 电容 | 33nF ±10% | 
| 额定电压 | 630VDC | 
| 温度特性 ? | X7R(±15%) | 
| 耗散因数 (Max.) | 3% | 
| 绝缘电阻 (Min.) | 10000MΩ | 
| 温度范围 | -55~125°C | 
| 焊接方法 | 流体回流 | 
| AEC-Q200 | NO | 
| 包装形式 | 塑封编带 (180mm卷筒) | 
| 包装个数 | 2000pcs | 
| 
 |